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Max Planck Insti­tute of Micro­struc­ture Phys­ics - Depart­ment of Nan­o­photon­ics, Integ­ra­tion, and Neural Tech­no­logy

The Max Planck Insti­tute of Micro­struc­ture Phys­ics, Halle, Ger­many, Depart­ment of Nan­o­photon­ics, Integ­ra­tion, and Neural Tech­no­logy is ini­ti­at­ing research pro­grams in devices and microsys­tems for future com­put­ing and brain activ­ity map­ping tech­no­lo­gies. We are launch­ing pro­grams in integ­rated photon­ics, AI accel­er­at­ors, implant­able brain probes, mini­ature micro­scopes, and 3D cell cul­tures. Our research crosses many bound­ar­ies, so our team mem­bers must have an open mind and a strong tech­nical found­a­tion that allow them to answer to new chal­lenges.

We are recruit­ing for mul­tiple pos­i­tions with vari­ous skill and edu­ca­tion require­ments. Our depart­ment has a mix of Ph.D. stu­dents, postdocs, sci­ent­ists, and staff from around the world. The work­ing lan­guage in the Insti­tute is Eng­lish. We are a hard­work­ing and sup­port­ive team.

The Max Planck Soci­ety aims to employ more per­sons with dis­ab­il­it­ies and increase the num­ber of women in those areas where they are under­rep­res­en­ted; thus, applic­a­tions from per­sons with dis­ab­il­it­ies and women are encour­aged.

Microsys­tems Pack­aging Research Engin­eer

Work­ing field:

We are recruit­ing a Microsys­tems Pack­aging Research Engin­eer to design and imple­ment pack­aging solu­tions for mul­ti­func­tional micro- and nano-scale devices. We are cre­at­ing micro­chips for brain implants and brain-com­puter inter­faces, microd­isplays, sens­ing, and neur­omorphic com­put­ing. These micro­chips often co-integ­rate mul­tiple tech­no­lo­gies, such as photon­ics, elec­tron­ics, MEMS, and micro­fluidics. To be use­ful, these micro­chips must be pack­aged to inter­face with the rest of the sys­tem, such as other micro­elec­tronic cir­cuits, cables, con­nect­ors, fiber optics.

Require­ments:

Your tasks
  • Design, develop, and imple­ment pack­aged microsys­tems for micro­chips with photonic, elec­tronic, and micro­fluidic func­tion­al­it­ies
  • Sim­u­late and model sys­tem-in-pack­age for thermal, mech­an­ical, optical, elec­trical, fluid flow prop­er­ties
  • Pack­age micro­chips with car­ri­ers, rigid & flex­ible prin­ted cir­cuit boards, con­nect­ors, flex­ible cables, optical fibers, lenses, flu­idic tubing, etc. using a com­bin­a­tion of wire­bond­ing, flip-chip bond­ing, adhes­ive bond­ing, 3D print­ing, 3D laser writ­ing tech­niques
  • Assist in estab­lish­ing the pack­aging facil­ity in the NINT Depart­ment

Your pro­file
  • You have 2+ years of work exper­i­ence in opto­elec­tronic, optical, elec­tronic, MEMS, and/or micro­fluidic pack­aging
  • You have exper­i­ence in assembly pro­cesses such as wafer grind­ing, dicing, die attach, fiber attach, die-stack­ing of thin dies, flip-chip bond, wire-bond, encap­su­la­tion, under­fill, mold­ing, ball attach, gels for envir­on­mental pro­tec­tion, pick-and-place, sin­gu­la­tion
  • You are exper­i­enced with mech­an­ical CAD tools such as Auto­CAD/Solid­works
  • Prior exper­i­ences in mod­el­ling and resolv­ing issues related to thermal and mech­an­ical stresses (e.g., using COM­SOL), optical propaga­tion (e.g., Zemax) are strong assets
  • Prior exper­i­ences in the design and test of bio­med­ical implants are assets
  • You are motiv­ated by grand chal­lenges
  • You are a fast learner and excited to learn about other dis­cip­lines
  • You are an effect­ive team player that excels in a fast-paced, highly dynamic, inter­dis­cip­lin­ary and inter­na­tional envir­on­ment
  • You have good writ­ten and oral com­mu­nic­a­tion skills in Eng­lish

What we of­fer:

  • The oppor­tun­ity to work at the fore­front of sci­entific research with an incred­ible team of highly motiv­ated and smart people
  • Remu­ner­a­tion and social bene­fits accord­ing to TVöD
  • Fixed-term con­tract ini­tially for 2 years, with the poten­tial of exten­sion
  • Expec­ted start date: Janu­ary 2020; nego­ti­able

How to ap­ply:

Please sub­mit your resume with the names of two ref­er­ences to jobs.nint@mpi-halle.mpg.de ref­er­en­cing MPI-Halle-PKG. The pos­i­tion will remain open until closed.